PCB Printed Circuit Board LED Lighting Audio Amplifier Ready Control Module Poe Power Distribution Bank PCBA Power Supply Board
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Key attributes
Customization
Available
Type
Rigid Circuit Board
Dielectric
FR-4
Model No.
OKEYPCB
Material
Fiberglass Epoxy Resin + Polyimide Resin
Application
Medical Instruments
Flame Retardant Properties
V2
Mechanical Rigid
Fexible
Processing Technology
Delay Pressure Foil
Base Material
Aluminum
Insulation Materials
Metal Composite Materials
Brand
Okey
Shape
Retangular, Round, Slots, Cutouts, Complex, Irreg
Surface Finishing
OSP, Immersion Gold, Immersion Tin, Immersion AG
Layer
1-60 Layers
Service
Turnkey Assembly PCB Service
Other Capabilities
Repair/Rework Services Mechanical Assembly Box Bui
Min Hole Size
Mechanical Hole: 0.15mm, Laser Hole: 0.1mm
Outline Profile
Rout/ V-Cut/ Bridge/ Stamp Hole
Certificate
ISO9001, ISO14000, Ts16949.UL.RoHS
Order Qty
No Limited
Controlling Range
-40c~125c
Solder Resist Color
Green;Red;Yellow;Black;White
Surface Finished
HASL, Gold Finger, OSP, Enig, Peelable Mask
Trade Mark
OEM, ODM
Min. Line Width
4mil
Max Production Size
600*800mm
Transport Package
Inner Vacuum Packing Outer Carton Box
Specification
FR 4, 0.8mm, 1 Layer, 1OZ Copper Thickness
Trademark
OKEY/ODM OEM
Origin
China
Hs Code
8534009000
Production Capacity
Output 10 000 Square Meter Per Month
Stencil Size:
736x736mm
Minimum Ic Pitch:
0.2mm
Maximum Pcb Size:
1200x 500mm
Minimum Pcb Thickness:
0.25mm
Minimum Chip Size:
0201 (0.2x0.1)/0603 (0.6 x 0.3mm)
Maximum Bga Size:
74x74mm
Bga Ball Pitch:
1.00mm (minimum), 3.00mm (maximum)
Bga Ball Diameter:
0.40mm (minimum), 1.00mm (maximum)
Qfp Lead Pitch:
0.38mm (minimum), 2.54mm (maximum)
Volume:
One piece to low volume production quantities Low cost first article builds Schedule deliveries
Assembly Type:
Surface mount(SMT) assembly DIP assembly Mixed(surface mount and through hole) technology Single or double sided placement Cable assembly
Components Type:
Passive components: As small as 0402 package As small as 0201 with design review Ball Grid Arrays(BGA): As small as .5mm pitch
Parts Procurements:
Turnkey(we supply the parts) Consigned(you supply the parts) You supply some parts, we do the rest
Solder Type:
Leaded Lead-free/ROHS compliant
Other Capabilities:
Repair/rework services Mechanical assembly Box build Mold and plastic injection.
| Customization | Available |
|---|---|
| Type | Rigid Circuit Board |
| Dielectric | FR-4 |
| Model No. | OKEYPCB |
| Material | Fiberglass Epoxy Resin + Polyimide Resin |
| Application | Medical Instruments |
| Flame Retardant Properties | V2 |
| Mechanical Rigid | Fexible |
| Processing Technology | Delay Pressure Foil |
| Base Material | Aluminum |
| Insulation Materials | Metal Composite Materials |
| Brand | Okey |
| Shape | Retangular, Round, Slots, Cutouts, Complex, Irreg |
| Surface Finishing | OSP, Immersion Gold, Immersion Tin, Immersion AG |
| Layer | 1-60 Layers |
| Service | Turnkey Assembly PCB Service |
| Other Capabilities | Repair/Rework Services Mechanical Assembly Box Bui |
| Min Hole Size | Mechanical Hole: 0.15mm, Laser Hole: 0.1mm |
| Outline Profile | Rout/ V-Cut/ Bridge/ Stamp Hole |
| Certificate | ISO9001, ISO14000, Ts16949.UL.RoHS |
| Order Qty | No Limited |
| Controlling Range | -40c~125c |
| Solder Resist Color | Green;Red;Yellow;Black;White |
| Surface Finished | HASL, Gold Finger, OSP, Enig, Peelable Mask |
| Trade Mark | OEM, ODM |
|---|---|
| Min. Line Width | 4mil |
| Max Production Size | 600*800mm |
| Transport Package | Inner Vacuum Packing Outer Carton Box |
| Specification | FR 4, 0.8mm, 1 Layer, 1OZ Copper Thickness |
| Trademark | OKEY/ODM OEM |
| Origin | China |
| Hs Code | 8534009000 |
| Production Capacity | Output 10 000 Square Meter Per Month |
| Stencil Size: | 736x736mm |
| Minimum Ic Pitch: | 0.2mm |
| Maximum Pcb Size: | 1200x 500mm |
| Minimum Pcb Thickness: | 0.25mm |
| Minimum Chip Size: | 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) |
| Maximum Bga Size: | 74x74mm |
| Bga Ball Pitch: | 1.00mm (minimum), 3.00mm (maximum) |
| Bga Ball Diameter: | 0.40mm (minimum), 1.00mm (maximum) |
| Qfp Lead Pitch: | 0.38mm (minimum), 2.54mm (maximum) |
| Volume: | One piece to low volume production quantities Low cost first article builds Schedule deliveries |
| Assembly Type: | Surface mount(SMT) assembly DIP assembly Mixed(surface mount and through hole) technology Single or double sided placement Cable assembly |
| Components Type: | Passive components: As small as 0402 package As small as 0201 with design review Ball Grid Arrays(BGA): As small as .5mm pitch |
| Parts Procurements: | Turnkey(we supply the parts) Consigned(you supply the parts) You supply some parts, we do the rest |
| Solder Type: | Leaded Lead-free/ROHS compliant |
| Other Capabilities: | Repair/rework services Mechanical assembly Box build Mold and plastic injection. |
Packaging and delivery
| Selling Units | Single item |
|---|---|
| Package Type | Standard export packaging |
| Lead Time | 7-14 days after payment |
Protections
Secure Payment
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Quality Assurance
Products are verified before shipment. Contact us within 7 days if you receive defective items.
Buyer Protection
Full refund if product is not as described or doesn't arrive on time.
Supplier
🏭
Shenzhen Okey Circuit Co., Ltd.